CFMEE (09630) saw its share price climb more than 10% during intraday trading. As of the time of writing, the stock was up 7.84%, trading at HK$371.60, with turnover reaching HK$102 million.

During the 2026 interim results conference held on September 14, the company's chairman, Cheng Zhuo, stated that for the second half of the year, order deliveries for high-end PCB equipment remain robust. Advanced packaging equipment has also entered the validation and deployment phase. Looking ahead to next year, the expansion of AI servers, related substrates, and advanced packaging is expected to continue driving incremental demand for equipment.

The company's second-phase manufacturing facility was in a ramp-up phase during the first half of the year, with overall capacity utilization maintained at a high level. For the full year, the second-phase capacity is scheduled to enter its complete release phase in the second half, leveraging modular production and pre-positioned core component inventories to continuously fulfill orders for high-end PCBs and advanced packaging equipment.

Shanghai Securities noted that CFMEE's second-phase base, which began production in Q3 2025, entered its capacity ramp-up stage in H1 2026. With a total design capacity exceeding double that of the first phase, the new facility effectively alleviates the previous capacity overload bottleneck, and the facility maintained high operating rates throughout the first half. The company's order book across all product lines remains full, with new orders signed in Q1 2026 surpassing RMB 800 million. The second quarter has sustained this elevated momentum, with particularly strong growth in orders for pan-semiconductor advanced packaging and high-end IC substrate equipment. The product mix continues to optimize toward higher-value, higher-margin machine models.