Hong Kong Stock Market Flash | CFMEE Surges Over 7% as High-End PCB Orders Keep Pipeline Full and Advanced Packaging Poised for Growth

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Yesterday

Shares of CFMEE (09630) climbed more than 7% during Hong Kong trading hours. As of the time of writing, the stock was up 7.69% at HK$383.80, with turnover reaching HK$132 million.

On the news front, CFMEE Chairman Cheng Zhuo stated at the recent interim results conference that the company is holding a robust order backlog, fueled by demand from AI servers and high-speed optical modules. Cheng noted that production scheduling for the company's high-end PCB products—spanning HDI, high-multilayer, and IC substrate/similar substrate lines—remains fully loaded. With the Phase II base's full capacity coming online in the second half of the year and coordinated operations between Phase I and II, the company will continue to expand capacity and boost efficiency to accelerate delivery of existing orders.

Previously, Sinolink Securities pointed out that the Phase II base, which began production in Q3 2025, is entering its capacity ramp-up phase in H1 2026, with overall design capacity exceeding twice that of Phase I. The company has locked in long-lead-time core optical and motion control components in advance, keeping full-cycle capacity utilization at elevated levels during the first half. Additionally, the company's WLP2000 wafer-level direct-write lithography equipment has been shipped in volume to leading domestic OSAT firms, having passed reliability validation on a top player's CoWoS-L production line and secured repeat bulk orders.

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