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Tuttle Capital Memory Stack Income Blast ETF

20.55

+0.88054.48%

Post-market: 20.53-0.0205-0.10%17:01 EDT

Volume:16.30K

Turnover:334.17K

Market Cap:5.96M

PE:- -

High:20.63

Open:20.27

Low:20.27

Close:19.67

52wk High:34.00

52wk Low:17.26

Shares:290.00K

Float Shares:290.00K

Volume Ratio:1.67

T/O Rate:5.62%

Dividend:2.01

Dividend Rate:9.78%

ROE:--

ROA:--

PB:--

PE(LYR):- -

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Overview Company News Filings

HBM Holdings to Join Hang Seng Composite Index

MT Newswires Live

Hong Kong Memory Chip Stocks Plunge as Samsung Drops Nearly 8%, Leveraged Product Sinks 16%

HBM Holdings to Join Hang Seng Composite Index, Aiming to Boost Liquidity and Investor Reach

Memory Manufacturing's Material Shift: Why Molybdenum is Replacing Tungsten in Advanced 3D NAND

Capital Floods Into Semiconductor Upstream Assets As Memory Chip and Power Semiconductor Cycles Align

Surprise Boost! US Memory Chip Stocks Climb in Premarket Trading

SK hynix Launches Massive Treasury Share Buyback for Cancellation

Two Investment Experts Explain Why They Are Steering Clear of Memory Stocks

Analysts Offer Insights on Materials Companies: Royal Gold (RGLD) and Hudbay Minerals (HBM)

Hanmi Semiconductor Expands Capacity and Enters U.S. Market to Capture AI and HBM Demand

From heated rivalry to frenemies: Inside the cutthroat business of ruling tech in Asia

DRAM vs. SOXX vs. SMH: 3 Semiconductor ETFs to Buy for AI Growth

Applied Materials Beat Q3: Advanced Packaging +70%, HBM Momentum, $555 Caps Recovery Into Jackson Hole

HBM's Cancer Drug Candidate Gets China Approval

MT Newswires Live

Memory chip shares stage a robust rebound

AI Server Demand to Keep Driving NAND Flash Growth in 3Q

AI Server Demand Drives NAND Flash Revenue Surge in Q2 2026

Memory Cycle Mismatch: Valuations Signal Late Stage While Fundamentals Remain Robust

South Korea Denies Chips Will Be First Project of $350 Billion US Investment as Talks Progress

Huayuan Securities: CPO Poised to Unlock New Growth for Optoelectronic Equipment, Focus on Three Core Investment Themes of Testing, Coupling, and Advanced Packaging

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process up to trillions of calculations at once to train generative models.That has stretched thin the capacity of key suppliers of accelerators designed by industry leaders Nvidia and AMD, whose products count on the increasingly intertwined supply chain linking Taiwan and South Korea.Highlighting the urgency of the strained supplies amid the AI boom, Nvidia CEO Jensen Huang scribbled a 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Advanced packaging +70% (new guidance), HBM pushing DRAM to 26% of SemiSys. Q4 guide $10.25B ±$500M. Technical: $507 support, $555 resistance, $587-623 targets. 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