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Defiance Daily Target 2x Long AMKR ETF

6.21

+0.54009.52%

Post-market: 6.220.0100+0.16%16:10 EDT

Volume:167.39K

Turnover:995.84K

Market Cap:7.39M

PE:- -

High:6.21

Open:5.85

Low:5.74

Close:5.67

52wk High:33.00

52wk Low:5.08

Shares:1.19M

Float Shares:1.19M

Volume Ratio:1.24

T/O Rate:14.07%

Dividend:- -

Dividend Rate:- -

ROE:--

ROA:--

PB:--

PE(LYR):- -

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Overview Company News Filings

Philadelphia Semiconductor Index Climbs 1% at Market Open

Hong Kong Stock Market Flash | CFMEE Surges Over 7% as High-End PCB Orders Keep Pipeline Full and Advanced Packaging Poised for Growth

Philadelphia Semiconductor Index Opens 1.5% Higher at 11335.79 Points

Semiconductor Benchmark Plunges 6% to 11,114.65 Points

Historic Move: Diesel Tops $6 — Could the U.S. Unleash "Export Curbs"?

Diesel Prices Shatter $6 Mark: Is Washington Poised to Trigger a Supply Squeeze?

Philadelphia Semiconductor Index Surges 2% to 11,848.33 Points

Amkor CFO Megan Faust Sells 1,000 Common Shares for $49,050

Deep-tech Firm Invests 1.85 Billion Yuan to Boost Advanced Memory Chip Packaging Capacity

PsiQuantum Finalizes $100M CHIPS Act Funding for U.S. Quantum Push

Amkor Launches Phase 2 of Arizona Advanced Packaging, Test Campus

MT Newswires Live

Amkor Technology, - Phase 2 Construction to Begin Late 2027, Completion Expected by End of 2029

THOMSON REUTERS

Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion

THOMSON REUTERS

Amkor Technology, - Expansion Increases Planned Investment to $12 Bln

THOMSON REUTERS

Amkor Technology, - Phase 1 and 2 Expected to Support over 3,500 Arizona-Based Employees

THOMSON REUTERS

SEMICON 2026 Key Takeaways: Advanced Packaging Shifts Toward 3D System Integration, While CPO Manufacturing Faces Testing Hurdles

Amkor Technology put volume heavy and directionally bearish

Semiconductor Sector Faces Crowding Correction; Analysts Flag Fundamental Plays for September

Amkor to Present at Goldman Sachs Communacopia + Technology Conference

AUO Showcases Micro LED Optical Communication and Glass Core Substrates Technologies at SEMICON Taiwan 2026

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